H Series

The H series target the mainstream data center workloads. They are primarily available in the half-height half-length (HHHL) add-in card form factor.

E Series

The E series target the low-end data center workloads. They are primarily available in the U.2 drive form factor.

O Series

The O series are high-performance, high-density cards. They are primarily available in full-height half-length (FHHL) add-in card form factor.


H Series Specifications

Series H-Series
ModelName H2100 H3100
Capacity(GB) 1.5T/3T 1.5T/3T/6T
FormFactor HHHL
Protocol NVMe
Optimized Mainstream
Interface PCIeGen2x8 PCIeGen3x8
Technology MLC
4KBRandomIOPS(K) 660/200 1000/400
Latency(us) 105/11
SequentialBW(GB/s) 3.0/1.0 4.0/2.0
Endurance(DWPD) 3
Warrenty(Year) 5
MTBF(MHours) 2
OperatingTemp. 0°to55°C(ambient)
Non-OperatingTemp. 0°to70°C
ActivePower(W) 25
IdlePower(W) 4

E Series Specifications

Series E-Series
ModelName E3100
Capacity(GB) 1.5T/3T/6T
FormFactor U.2
Protocol NVMe
Optimized Mainstream
Interface PCIeGen3x4

O Series Specifications

Series O-Series
ModelName O3200 O3300
Capacity(GB) 2T/5T/9T 7T/12T/18T
FormFactor FHHL
Protocol NVMe
Optimized Performance Density
Interface PCIeGen3x8 PCIeGen3x8
Technology MLC TLC
4KBRandomIOPS(K) 1400/600 800/400
Latency(us) 105/11
SequentialBW(GB/s) 6.0/3.0 3.2/2.5
Endurance(DWPD) 3 1
Warrenty(Year) 5 5
MTBF(MHours) 2 2
OperatingTemp. 0°to55°C(ambient)
Non-OperatingTemp. 0°to70°C
ActivePower(W) 40 40
IdlePower(W) 8 8


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